Products > Crosswind 600 3U PCIe Gen2 ATR Style Light Weight Chassis

"Crosswind 600" 6 slot VPX COLD PLATE PCIe Gen2 chassis:


  • 10 pound chassis
  • Highest function density in a small form factor 3U ATR chassis
  • VPX 3U
  • 1/6th smaller than the competitions 3U 6 slot VPX chassis

PCI-Systems innovative 1-2-3 system. 1: Lab unit 2: Configure unit 3: Deploy unit!
All our chassis and prototype systems can be deployed without needing to change out the chassis. Add Front and rear custom covers and full sealing and you are ready to go to qualification! 

Crosswind 600 6 slot VPX COLD PLATE PCIe Gen2 chassis



Cold plate mounting. The fin  design and wall thickness was analyzed with Flowmetrics software and designed for minimum delta T offset in an average thermal load application. The design was then verified in real life environmental chamber experiments with a sealed chassis using our 3U heat simulator modules. Data available upon request. 

Part of our thermal design process on the module level is the VITA REDI specification, consisting of  “best practice” rules and suggestions for the thermal layout of the PCB.  We also use additional techniques like large copper planes in the PCB, and have various module cover heat transfer solutions. We can also thermally attach your module to a sidewall of the chassis, giving one or more chips a direct travel path for heat from the top of the chip. 

All of these technologies and methods combine to a very stable thermal dissipation platform.



This chassis features milled out areas inside the chassis, which lower the overall weight to 4 kilos or 8.8 pounds.









EMI and Painting

The chassis is chromatized on all surfaces before applying custom primary and secondary coatings of your choice.  Primer:  Epoxy Chromate free per mil-p- 53022, 1 coat 30-50 microns. Outside: Polyurethane low voc mil-c-83286 color RAL TBD per fed std 595, 1 coat at 25-30 microns.
EMI is therefore minimized as effectively as possible and can be further minimized by using SSC on all slots in the system.  
Technology Overview

- Aluminum 
- Milled weight savings slots
- Chromatized and painted
- NEMA 4x IP65 sealing
- GORE Vents for atmospheric pressure equalization
- Void fillers for condensation control
- COAX duct routing front I/O from card to card to rear I/O
- MIL-DTL-38999 connectors 
- Custom I/O
- Rugged On/Off switch
Cold plate mounting
- IPC class 3
- Conformal coating
- Distributed PCIe100 MHz clock
- Amphenol rugged VPX connectors available
- Passive backplane with active mezzanine
- Standard or custom I/O
- Custom mezzanine for OpenVPX slot profiles



  • PCI_800.470 *3U Crosswind 600, Chassis, passive backplane, power supply, standard rear I/O


For technical specifications please ask your representative for the DATA SHEET or fill out the request formhere.